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fine grinding mesh number wafer Grinding wheels for manufacturing of silicon wafers A ABSTRACT Although diamond grinding is the most ...
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(54) Method for manufacturing semiconductor wafer (75) Inventors: KiKwon Jeong, Cheonansi (KR); Hyeon Hwang, Cheonansi (KR) (73) Assignee:
Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations . Na Qin a, b, Pei b ∗, Gram R. Fisher c, J. Liu b, d
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Official FullText Paper (PDF): Edge chipping of silicon wafers in diamond grinding
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Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations . Na Qin a, b, Pei b ∗, Gram R. Fisher c, J. Liu b, d
NANO WhEElS; MAxiMuM ADANTAv gES ... wafer) GRINDING CURRENT (Amps) NUMBER OF GRINDS 0 30 60 90 120 150 ... Fine Grind – Z2 >120 μm/wafer
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